- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 103/00 - Materials to be soldered, welded or cut
Patent holdings for IPC class B23K 103/00
Total number of patents in this class: 1564
10-year publication summary
143
|
256
|
267
|
243
|
205
|
164
|
146
|
84
|
39
|
9
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1745 |
100 |
Corning Incorporated | 9932 |
99 |
TRUMPF Laser- und Systemtechnik GmbH | 505 |
36 |
Hamamatsu Photonics K.K. | 4161 |
33 |
SCHOTT AG | 1675 |
27 |
Siltectra GmbH | 88 |
22 |
Applied Materials, Inc. | 16587 |
20 |
Saint-Gobain Glass France | 3641 |
20 |
Samsung Display Co., Ltd. | 30585 |
19 |
IPG Photonics Corporation | 494 |
19 |
Seurat Technologies, Inc. | 126 |
19 |
Agc, Inc. | 4029 |
17 |
Rtx Corporation | 8674 |
16 |
Apple Inc. | 50209 |
13 |
General Electric Company | 18133 |
13 |
ArcelorMittal | 1887 |
11 |
LPKF Laser & Electronics AG | 112 |
11 |
Nippon Electric Glass Co., Ltd. | 2299 |
10 |
The Boeing Company | 19843 |
9 |
Boe Technology Group Co., Ltd. | 35384 |
9 |
Other owners | 1041 |